ThermoCore
Carbon-based Heat Spreader
Carbon-based Thermal Management Materials:
ThermoCore™
Effective heat management is vital for industries reliant on high computational power. AI applications, like machine learning and neural network training, and 5G infrastructure, with its high data loads and low latency demands, push devices to thermal extremes, risking system stability without adequate cooling.
Carbonix Materials addresses these challenges with cutting-edge carbon-based materials, designed to enhance thermal efficiency. By ensuring reliable heat dissipation during intensive workloads, TCMC’s solutions boost performance, longevity, and energy efficiency while reducing reliance on excessive cooling systems.
Key Differences in Heat Transfer Mechanisms:
ThermoCore™ HS Series
(In-plane/Lateral Heat Transfer)
Spreads heat laterally within the sheet, useful for devices with surface-based heat sources.
(X-Y direction)
ThermoCore™ TIM Series
(Through-plane Heat Transfer)
Conducts heat upwards, ideal for components with concentrated heat sources requiring efficient cooling.
(Z direction)
ThermoCore™ HS Series
| Type | HS-25 | HS-40 | HS-50 | HS-70 | HS-90 | HS->110 | ||
| Thickness (μm) | 23±2 | 32±2 | 50±5 | 70±5 | 90±5 | Customized | ||
| Density (g/cm3) | ≧2.0 | ≧2.0 | > 2.0 | > 2.0 | > 2.0 | > 2.0 | ||
| Thermal Conductivity | In-plane | 1,600±100 | 1,600±100 | 1,500 ± 100 | 1,300 ± 100 | 1,200 ± 100 | 1,200 ± 100 | |
| (W/mK) | Through-plane | 3 – 5 | 3 – 5 | 3 – 5 | 3 – 5 | 3 – 5 | 3 – 5 | |
| Thermal Diffusivity (mm2/s) | > 800 | > 800 | > 800 | > 800 | > 750 | > 750 | ||
| Specific Heat Capacity (J/gK) | 0.85 | 0.85 | 0.85 | 0.85 | 0.85 | 0.85 | ||
| Electrical Conductivity (S/cm) | > 12,000 | > 12,000 | > 12,000 | > 12,000 | > 10,000 | > 8,000 | ||
| Working Temperature (℃) | -40 ~ 400 | |||||||
| Standard Size | Roll | 120 mm width, | Customized | |||||
| 100 or 200 (under 100 μm)-meter per roll | ||||||||
| Sheet | 120 X 250 mm | |||||||
| Testing Conditions | RoHS, HAST, PCT, HTST (1,000hrs@150℃), | |||||||
| TCT(-55~125℃,40mins, 1,000 cycles) | ||||||||
High Thermal Conductivity
High thermal conductivity within the plane of the sheet, ideal for spreading heat laterally.
Lightweight Design
Lightweight and flexible, suitable for integration into compact electronic devices.
Even Heat Distribution
Effective in devices with heat sources spread across the surface, ensuring even heat distribution.
| Type | Thermal Sheet Only | Adhesive Types | ||||||||||||||||||
| P | R | RA | RB | RC | ||||||||||||||||
| Structure |
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| Features |
| Backing Released on One Side of the Film | One-side Insulated Adhesive Tape | Two-sides Insulated Adhesive Tape |
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| Products Form | Sheet | Sheet | Sheet | Sheet | Sheet | |||||||||||||||
X-Cooler
Adhesive ( 3-5 μm)
Release Film
Insulated Tape ( 3-5 μm)
Easy integration into customer products, offering a variety of specifications to accommodate various applications.
ThermoCore™ TIM Series
Graphene Thermal Interface Materials (TIMs) represent a cutting-edge solution in thermal management, characterized by extraordinary properties that set them apart from traditional materials.
In electronics, graphene TIMs are revolutionizing heat dissipation for processors, smartphones, and computing systems. The automotive and aerospace industries are exploring its potential for advanced thermal management solutions. Battery technologies benefit from graphene’s ability to improve charging efficiency and thermal stability, potentially extending device lifespans.
ThermaComp™- EVF
High-compressibility TIM optimized for demanding heat and electrical management applications.
ThermaComp™- PMO
High-compressibility and enhanced mechanical strength TIM with low electrical conductivity (<100 S/cm), designed for applications requiring efficient heat dissipation with minimal electrical conduction.
| EVF | PMO | |
| Thickness (μm) | 75, 100, 400 | 100, 200 |
| Weight (mg/cm2) | 1.7 – 8.5 | 2.0 – 4.5 |
| Compressibility (%@200kPa) | > 50 | > 40 |
| Thermal Resistance (Kcm2/W) | < 0.38 | < 0.38 |
| In-plane Thermal Conductivity (W/mK) (depends on the compressibility) | > 200 | > 200 |
| Thermal Diffusivity (mm2/s) | > 200 | > 200 |
| Specific Heat Capacity (J/gK) | 0.85 | 0.85 |
| Tensile Strength (MPa) | > 1.0 | > 2.0 |
| Electrical Conductivity (S/cm) | > 2,000 | < 100 |
| Working Temperature (°C) | -40 ~ 400 | -40 ~ 400 |
| Standard Size | 150 x 280 mm (Customized available) | 70 x 70 mm (Customized available) |
| Key Features | Low thermal resistivity, High compressibility | Low thermal resistivity, High compressibility, enhanced mechanical strength |
Low Thermal Resistivity
Graphene's exceptional thermal conductivity surpasses conventional TIMs, reducing thermal resistivity, and enabling faster heat dissipation.
Excellent Thermal Interface
Provides an efficient pathway for heat transfer to larger heat sinks or cooling systems.
Vertical Heat Transfer
Ideal for components with concentrated heat sources, allowing for efficient vertical heat dissipation.
Chemical Stability and Durability
Graphene exhibits exceptional chemical stability and resistance to degradation, ensuring long-term performance.
Carbon-based thermal films:
Innovative, cost-effective, and highly effective in heat management.
- Automotive
- High-Performance Computing
- Consumer Electronics
- Aerospace
- Data Center
- Industrial machinery
- Power generation
- Smart Phones
- Servers
